【Granted Patent】Congratulations to A.P. Wei Chia-Chien on the grant of U.S. patent for “Method and apparatus for signal processing by light waveform shaping”
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Inventor |
Associate Professor Wei, Chia-Chien |
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Department |
Department of Photonics |
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Title |
Method and apparatus for signal processing by light waveform shaping |
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Patent No. |
US10,299,020 B1 |
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Issued Date |
May. 21, 2019 |
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Abstract |
A method and apparatus for signal processing by light waveform shaping are provided to process an uplink signal generated by a digital-to-analog converter (DAC) and/or process a downlink signal to be transmitted to an analog-to-digital converter (ADC). The method includes adjusting the waveform of the uplink signal and/or the waveform of the downlink signal with a light waveform shaping module so that, even if the DAC and/or ADC has a low sampling rate and a narrow bandwidth, a high-frequency signal portion of the uplink signal and/or a high-frequency signal portion of the downlink signal can be preserved. |
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Contact Person |
Evelyn Chiou(ext.2625) |
