【獲證專利公告】恭賀! 物理系張鼎張教授及團隊之研究成果「材料的接合方法及分離方法」獲得美國發明專利
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發明人 |
張鼎張教授 |
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系所 |
物理系 |
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專利名稱 |
材料的接合方法及分離方法 |
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證書號 |
US10,792,904B2 |
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公告日期 |
109年10月6日 |
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專利摘要 |
A method for bonding a first component to a second component includes placing the first and second components in a cavity. Each of the first and second components has a bonding portion, and the bonding portion of the first component faces the bonding portion of the second component. A supercritical fluid is then introduced into the cavity with a temperature of 40-400° C. and a pressure of 1,500-100,000 psi, and a pressure of 4-100,000 psi is applied on both the first and second components, assuring the bonding portion of the first component bond to the bonding portion of the second component. Moreover, a method for separating a first component from a second component includes placing a composite in a cavity. The composite includes the first component, the second component and a connecting layer by which the first component joins to the second component. The supercritical is then introduced into the cavity.
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技轉服務窗口 |
邱識蓉(分機2625) |
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