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【Granted Patent】Congratulations to Prof. Chang, Ting-Chang on the grant of U.S. patent for “ Method for bonding one component to another component”

 

Inventor

Professor Chang, Ting-Chang

Department

Department of Physics

Title

Method for bonding one component to another component

Patent No.

US10,792,904B2

Issued Date

Oct. 6, 2020

Abstract

A method for bonding a first component to a second component includes placing the first and second components in a cavity. Each of the first and second components has a bonding portion, and the bonding portion of the first component faces the bonding portion of the second component. A supercritical fluid is then introduced into the cavity with a temperature of 40-400° C. and a pressure of 1,500-100,000 psi, and a pressure of 4-100,000 psi is applied on both the first and second components, assuring the bonding portion of the first component bond to the bonding portion of the second component. Moreover, a method for separating a first component from a second component includes placing a composite in a cavity. The composite includes the first component, the second component and a connecting layer by which the first component joins to the second component. The supercritical is then introduced into the cavity.

Contact Person

Evelyn Chiou(ext.2625)chiouATmail.nsysu.edu.tw

 

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