【Granted Patent】Congratulations to Prof. Chang, Ting-Chang on the grant of U.S. patent for “ Method for bonding one component to another component”
Inventor |
Professor Chang, Ting-Chang |
Department |
Department of Physics |
Title |
Method for bonding one component to another component |
Patent No. |
US10,792,904B2 |
Issued Date |
Oct. 6, 2020 |
Abstract |
A method for bonding a first component to a second component includes placing the first and second components in a cavity. Each of the first and second components has a bonding portion, and the bonding portion of the first component faces the bonding portion of the second component. A supercritical fluid is then introduced into the cavity with a temperature of 40-400° C. and a pressure of 1,500-100,000 psi, and a pressure of 4-100,000 psi is applied on both the first and second components, assuring the bonding portion of the first component bond to the bonding portion of the second component. Moreover, a method for separating a first component from a second component includes placing a composite in a cavity. The composite includes the first component, the second component and a connecting layer by which the first component joins to the second component. The supercritical is then introduced into the cavity.
|
Contact Person |
Evelyn Chiou(ext.2625)chiouATmail.nsysu.edu.tw |
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